At this stage, the market only cares about whether we can make chips. But as the chip industry matures, the focus of the market in the future is bound to adjust to whether
we can manufacture chips efficiently. Although the market share of testing only accounts for 6% of the entire chip manufacturing industry chain, it is still a very important
industry, and even directly related to the quality of the finished chip, a slight mistake will cause incalculable costs. For a product, the market may pay more attention to its
characteristics in the early days of the market, but in the long run, it is still quality that determines the long-term value of the product.
What is chip testing? As the name suggests, chip testing refers to the process of chip manufacturing, inspection manufacturers through professional instruments to test the
chip semi-finished products, in order to improve the yield.
Every chip that comes to market needs to be tested before it can finally go to market, so there is actually a huge market demand during the chip testing phase. Many
biased investors think that testing is just a routine business after the chip is packaged, but in fact, it is worth much more than that.
According to the manufacturing process, chip testing can be divided into wafer testing (hereinafter referred to as in-process testing) and finished product testing
(hereinafter referred to as finished product testing). Their demand is to increase the output of terminal equipment, the purpose of controlling costs.
The concept of X-Ray
X-ray is a very short wavelength electromagnetic wave, wavelength range of 0.0006 to 80nm, it has a strong penetration, can penetrate the general visible light can not
penetrate a variety of different densities of matter.
The X-ray principle
X-rays use cathode-ray tubes to produce high-energy electrons that collide with metal targets. During the collision, the electrons suddenly slow down, and their lost kinetic
energy is emitted in the form of X-rays, which have very short wavelengths but high electromagnetic radiation. However, for the location where the sample cannot be
inspected by the appearance method, the change of the light intensity after the penetration of different density substances by recording X-Rayy can form an image to
show the internal structure of the object to be measured, and then the problem area inside the object to be measured can be observed without damaging the object to be
measured.
The application of X-Ray rays
1. Purpose of use:
Metal materials and parts. Plastic materials and parts. Electronic components. Electronic components. LED components and other internal cracks. Detect foreign body
defects, BGA. Analyze the internal deviation of circuit boards; Distinguish BGA welding defects such as air welding, air welding, microelectronic systems and plastic sealing
components, cables, fittings, and plastic parts.
2. Scope of application:
1) Insufficient detection in IC packaging such as: layer stripping. Burst. Detect wire integrity;
2) Defects that may occur in the manufacture of printed circuit boards, such as poor alignment or bridge and open circuit;
3)SMT solder joint cavity detection and measurement;
4) Detect open circuit, short circuit or abnormal connection insufficiency that may occur in various connection routes;
5) Integrity detection of tin balls in tin ball array package and chip encapsulation;
6) High-density plastic material rupture or metal material cavity detection;
7) Chip size measurement, line arc measurement, parts eating tin area ratio measurement.
Test process: Determine the sample type/material location and requirements → Put the sample into the X-Ray fluoroscope for X-Ray fluoroscopy inspection → picture
judgment analysis → mark the defect type and location. However, due to the characteristics of the material, the equipment will be subject to certain limitations, such as the
aluminum wire in the IC package or the low material density of the material will be penetrated and cannot be checked.
